SUMMARY
The mass tranfer notions during electrolytic deposition of metals were discussed on the base of fundamental hydrodynamic elements. The mass transfer during deposition of electroplated coatings can occur by the migration, diffusion and convection. The basic equations concerned these notions according to the field theory are given. The natural convection and convection diffusion are discussed in particular. The expressions corresponding with dimensionless Reynolds, Prandtl, Nusselt, Sherwood, Schmidt, Grashof, Reyleigh and Packet numbers are also shown. The mass transfer in the conditions of forced convection was described on the example of electrolyte flow between cathode and anode during displacement of strip electrode in electrolyser, as well as during cathode spraying with electrolyte. A device for selective gold spray plating of diode open-works, transistors and integrated circuits, as well as unit for highly efficient plating of printed circuit boards are presented. To-day metal electroplating processes are very frequently carried out in the conditions of turbulent flow of electrolyte. It helps to seriously accelerate to deposition process of metal coatings, especially the bright coatings. Therefore in the last years the mass transfer problems are broadly discussed in the electroplating literature..

Key words
Applied electrochemistry, electroplating, mass transfer.

¹ Instytut Mechaniki Precyzyjnej, Warszawa